| 摘要 |
PURPOSE:To remove the part accurately from the sheet, and to adsorb the part to an adsorbing head by projecting the second thrust-up bar inserted into the first thrust-up bar more than the top section of the first thrust-up bar. CONSTITUTION:A semiconductor pellet 4 intended to be removed rests just above the first thrust-up bar 6, the first thrust-up bar 6 rises, and the semiconductor pellet 4 is lifted up to predetermined height together with a thin-film 3 and the adhesive sheet 5 while the semiconductor pellet is held down by a sheet hold- down tool 9 lest the pellet should be lifted to height upper than that of the sheet hold-down tool 9. When the semiconductor pellet 4 and the adsorbing head 8 reach prescribed positions, the first thrust-up bar 6 stops its rise, the second thrust-up bar 7 with a needle-shaped top section 7' inserted into the first thrust- up bar 6 rises from the top section of the first thrust-up bar 6, breaks through the thin-film 3 and the adhesive sheet 5, and thrusts up the bottom of the semiconductor pellet 4, and the semiconductor pellet 4 is exfoliated, and adsorbed to the adsorbing head 8. |
