发明名称 COOLING UNIT FOR WIRING BOARD
摘要 PURPOSE:To protect the wiring board from harmful environment, and to prevent parts from corrosion and abrasion by covering the wiring board, to which a plurality of electronic circuit parts are attached and wired, with a sealed vessel and mounting a means cooling the wiring board or the attached parts to the vessel. CONSTITUTION:A part unit is manufactured in such a manner that the parts 2 are mounted to the wiring board 1 and the wiring board and the parts are connected mutually by wiring formed to the wiring board 1. The wiring board 1 is sealed into the vessel 3 consisting of upper and lower two sections so that terminal sections are projected through the tightening of a packing 6 and a tightening section 5. Methods such as the following methods are executed as the cooling means for the parts 2. (1) Cooling fins 4 are shaped to the upper and lower outer wall surfaces of the vessel 3. (2) Bars 7 having excellent heat transfer property are inserted into the vessel in airtight shapes and bonded onto the upper surfaces of the parts, and fins 8 are formed to the outside sections of the vessel of the bars 7. (3) Si group compound for radiation having excellent heat transfer property or an insulator such as Si rubber is filled and positioned to the lower section or upper and lower whole sections of a space section sealed. Accordingly, the breakdown of the parts and the degradation of characteristics under the harmful environment can be prevented.
申请公布号 JPS57133654(A) 申请公布日期 1982.08.18
申请号 JP19810020725 申请日期 1981.02.12
申请人 MITSUBISHI DENKI KK 发明人 FUJII MASAO;NAKAO KAZUNARI
分类号 H01L23/34;H05K7/20 主分类号 H01L23/34
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