METHOD OF THINNING CRYSTAL ROD OR CRYSTAL BLOCK BY USING CIRCULAR SAW WITH INNER HOLE AND SAWING IT TO DISK AND CIRCULAR SAW WITH SAID INNER HOLE

摘要

A process for the sawing of crystal rods or blocks into thin wafers by internal-hole saws is specified. In this process, the deviation of the saw blade from the intended cutting line, occurring in virtually every sawing operation, is countered by the force of a fluid being applied, at least periodically, to the side surfaces of the blade. This allows the force conditions in the saw cut and thus the deflection of the saw blade, to be influenced. This process results in an improved geometrical quality of the wafers obtained and in prolonged service life of the saw blades which have to be resharpened less often.