| 摘要 |
PURPOSE:To eliminate the residual strain at the adhesion boundary of a semiconductor element and its metallic supporter and obtain good adhesive property by fixing the semiconductor element to its metallic supporter by thermoplastic resin compound filled with metal powder. CONSTITUTION:A metallic supporter 3 such as an external lead is heated and on its specified position a small fixing tablet 2 composed of a small piece of resin compound which is produced by mixing and cooling the mixture of 1 part of silver powder and 0.1-1 part of thermoplastic resin is mounted. A semiconductor element 1 is put on the tablet 2 and simultaneously the small tablet 2 is melted and after being left for 5-60sec the small tablet 2 is cooled by air with the metallic supporter 3 and the semiconductor element 1 is fixed. With this constitution, as only melting and cooling of solids are performed and hardening reaction is not performed, the control is easy and the contraction by the reaction at the time of melting does not occur and the contraction at the time of cooling occurs to the same amount as the thermal expansion, so that no strain is remained at the boundary of the semiconductor element and the fixing material. |
