| 摘要 |
PURPOSE:To enable a single apparatus to perform die bonding for die pads in two lines on a lead frame by a method wherein a first cam drives a sliding guide shaft back and forth and a second cam determines the whereabouts of an adsorbing needle provided on the adsorbing head. CONSTITUTION:A guide shaft 31 sliding back and forth shaft-wise holds a supporting shaft 32 movable back and forth. A first plate cam 11 causes the supporting shaft 32 to travel relative to the guide shaft 31. A second plate cam 51 drives an adsorbing needle 19 installed in an adsorbing head 18 located at the forward end of the supporting shaft 32, causing said adsorbing needle 19 to travel between the semiconductor chip 2 adsorbing position and a first line die pad position in a lead frame and then between the semiconductor chip 2 adsorbing position and a second line die pad position in the lead frame. This setup allows a single apparatus to perform die bonding for die pads in two lines on a lead frame, thereby ensuring a large-scale increase in productivity. |
