ADHESIVE FOR CHIP MOLD MAINLY FOR NON-RIGID PLASTICS FOAM,申请号JP19810009153-传众专利搜索

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发明名称	ADHESIVE FOR CHIP MOLD MAINLY FOR NON-RIGID PLASTICS FOAM
摘要
申请公布号	JPS57123275(A)	申请公布日期	1982.07.31
申请号	JP19810009153	申请日期	1981.01.24
申请人	WAKOO CHEMICAL KK	发明人	TAKAHASHI NOBUKIMI
分类号	C08J9/02;C08J9/00;C09J175/00	主分类号	C08J9/02
代理机构		代理人
主权项
地址

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