| 摘要 |
PURPOSE:To reduce the production ratio of improper hermetical seal for a semiconductor enclosure in a method of hermetically sealing the hollow part of the enclosure by combining a sealing adhesive with the fibrous plastic having high temperature softening property, thereby effectively filling a through hole chain produced due to pressure diference. CONSTITUTION:An external electrode 2 and an element chip 1 are arranged on an insulating substrate 5 made, for example, of beryllia or the like, and a cap 3 made of aluminum is sealed with an adhesive layer 7. This layer 7 is formed by bonding polypropylene non-woven fabric 9 having approx. 40mum of thickness on each of both side surfaces of an epoxy resin adhesive sheet 8 having approx. 300mum of thickness and punching the sheet in the shape of the surface to be bonded. The sealing conditions are pressure heating, bonding and curing at 180-240 deg.C for 20-40min. In this manner, the through hole chain produced at the initial stage of the sealing (at the time of softening the epoxy layer 8) can be effectively filled with molten non-woven fabric softened after the temperature has risen, thereby completely rigidly hermetically sealing the enclosure. |
