| 摘要 |
PURPOSE:To improve the heat radiation of a heat sink layer in a semiconductor device by providing the layer having good thermal conductivity in a substrate. CONSTITUTION:A pellet 12 is mounted on a substrate 10 made of a ceramic material, the electrode of the pellet 12 is connected via a wire 14 to the conductor part on the substrate 10, and a cap 16 is placed on the pellet 12 and is hermetically seated. On the other hand, the substrate 10 is formed in a shape that a copper layer 20 is sandwiched in the intermediate. In this manner, the heat produced from the pellet 12 is radiated from the direction of the cap 16, is further radiated directly externally through the layer 10 from the upper half of the substrate 10, and is radiated externally via the lower half of the substrate 10 from the layer 20, thereby improving the heat radiation of the heat sink layer. |
