发明名称 LOAD VARIABLE MECHANISM AT WIRE BONDER
摘要 PURPOSE:To reduce unevenness of bonding load and to enhance bondability of a wire bonder by a method wherein a load variable mechanism being enabled to set bonding load at every bonding point is provided. CONSTITUTION:A bonding arm 11 holding a capillary 10 pierced with a wire 51 is releasably supproted swingable freely to a head frame 13 by a supporting axis 15. A motor 31 provided with a rotary encorder 30 is fixed to the head frame 13, an output shaft of the motor 31 is connected to a female screw block 35 by a male screw 33, and moreover the bonding arm 11 and a driving block 17 are made to swing or to perform an up-and-down motion. A boss 26 provided swingable freely with a contactor 25 facing with the upper face of the bonding arm 11 is fixed to a clamping arm 24, and the contactor 25 is energized toward the direction of the bonding arm 11 by a spring 27. Load thereof can be regulated by turning a screw 28.
申请公布号 JPS57121243(A) 申请公布日期 1982.07.28
申请号 JP19810007752 申请日期 1981.01.21
申请人 SHINKAWA SEISAKUSHO:KK 发明人 YAMAZAKI NOBUHITO;SUGIURA KAZUO
分类号 H01L21/60 主分类号 H01L21/60
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