| 摘要 |
PURPOSE:To elevate the density of the mounting of an electronic apparatus by buryig a metallic electrode pair separating a dielectric substance to a bottom section in a package and forming a capacitor into the package. CONSTITUTION:The metallic electrodes 15 opposed parting the dielectric substance 14 are set up to a lower section of an island section 16 on which a chip 9 is mounted. The island section 16 forms one metallic electrode, and is normally connected to the minimum potential of a semiconductor integrated circuit. The other metallic electrode 15 is connected to an internal lead given the maximum potential of the semiconductor integrated circuit. Accordingly, the density of the mounting of the electronic apparatus can be increased when using the semiconductor integrated circuit in which the capacitor is shaped into the package. |
