发明名称 MARKING DEVICE FOR SEMICONDUCTOR WAFER
摘要 PURPOSE:To enable the formation of a large and stable laser mark with a low power device by forming a mark by emitting the laser light continuously at least more than twice. CONSTITUTION:A laser mark is formed on the surface of a semiconductor device by emitting first laser light. In other words, the metal wire 1 on the surface of the semiconductor device and a part of an oxidized film 2 are heated and molten by the laser light to form a laser mark. At this time the periphery of the laser mark is not molten, but becomes high temperature. When second emission of the laser mark is performed, a large laser mark 3' is formed. The mark 3' formed by the second emission is much larger than that produced at the first emission and stable.
申请公布号 JPS57113242(A) 申请公布日期 1982.07.14
申请号 JP19800188212 申请日期 1980.12.29
申请人 NIPPON DENKI KK 发明人 TEZUKA AKITOSHI
分类号 H01L21/66;(IPC1-7):01L21/66 主分类号 H01L21/66
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