发明名称 Heat curable organopolysiloxane compositions
摘要 The invention provides a novel heat curable organopolysiloxane composition capable of giving a cured product having a remarkably high hardness and excellent anti-crack resistance. The cured product is also free from surface tackiness even by heat-curing in air. The main component of the composition is an organopolysiloxane having vinyl groups, phenyl groups and silicon-bonded hydrogen atoms simultaneously in a molecule or a mixture thereof with a second organopolysiloxane having vinyl groups and phenyl groups but no silicon-bonded hydrogen atoms in the molecule. It is essential that the molar ratios of the vinyl groups, phenyl groups, silicon-bonded hydrogen atoms and, if any, alkyl groups in the organopolysiloxane or organopolysiloxanes to the silicon atoms must be within specifically defined ranges and the organopolysiloxane component is admixed with a platinum catalyst for the addition reaction between the vinyl groups and the silicon-bonded hydrogen atoms as well as an organic peroxide such as dicumyl peroxide.
申请公布号 US4339564(A) 申请公布日期 1982.07.13
申请号 US19800190039 申请日期 1980.09.23
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 OKAMURA, YOSHIO
分类号 C08K5/14;C08G77/04;C08L71/00;C08L71/02;C08L83/00;C08L83/04;C08L83/05;C08L83/07;(IPC1-7):C08G77/06 主分类号 C08K5/14
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