| 摘要 |
PURPOSE:To correct the position of a semiconductor chip surface relative to a chip mounting substrate and thereby prevent a short circuit by a method wherein an electrode of a semiconductor chip surface and an electrode of a chip mounting substrate is provided with a bumper ball that is caused to melt by heat and then merges with the other when two electrodes facing with each other are connected. CONSTITUTION:Each of the bonding pads 3 of an IC chip 2 is provided with a bumper ball 4 and each of the bonding pads 6 connected to the leads 12 of a package 5 that is to mout the chip 2 is also provided with a bumper ball 11 confronting the bumper ball 4. Next, the ball 4 is made to face downward to abut against the ball 11 opposing it. The ball 4 and ball 11 are then subjected to high temperatures, melting and merging with each other, when a surface tension F is generated on the surface of the combination. The force is inclined to transform the liquefied balls into a sphere, which in turn causes the light weight chip 2 to travel a very short distance in line with the transformation of the merged balls into a sphere, automatically providing the chip with a corrected position ensuring excellent electric junction. |
