| 摘要 |
PURPOSE:To perform fixing of leads of a semiconductor device enabling to attract and hold a magnet by a method wherein lead out leads consisting of a ferromagnetic body covered with a metal having favorable heat radiability and electrodes are soldered to form slug leads, and a pellet is pinched between them and soldering is performed to fix. CONSTITUTION:The Si pellet 13 having a cathode electrode 17, an anode electrode 18 forming contact is pinched and held from both sides with the lead out electrodes 15, 16. The outside lead out leads 21, 22 are formed by making ferromagnetic Fe as a core 23, and covering the surface thereof with a clad film of a Cu thin film 24 having favorable heat radiability. The outside lead out members are fixed to the lead out electrodes through an Ag solder material 25. Accordingly the outside lead out leads being able to attract and hold the magnet can be obtained at low cost and moreover mass production can be attained. |
