发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PURPOSE:To match the connection of a lead easily aligned, and to insert a semiconductor pellet accurately by removing frame hangers at four corners from the side inner than a square surrounded by the four corners of a supporting frame when the pellet is cut from a tape and inserted into a cavity in a case. CONSTITUTION:The frame hangers at four corners are punched by means of a punch according to a tape carrier system. Even when the hangers are punched at that time, the semiconductor pellet 3 does not slip off because the supporting frame 7 and the pellet are connected to the tape 1 by the lead 5. Accordingly, escapes 15 are formed at the four corners of the supporting frame 7. The semiconductor pellet 3 is cut, and incorporated into the case 9. The whole supporting frame 7 is encased into the cavity 10, and a terminal of the lead 5 and an internal terminal 13 contact. Consequently, connection is easily aligned, and the displacement of contact is prevented.
申请公布号 JPS5796562(A) 申请公布日期 1982.06.15
申请号 JP19800173521 申请日期 1980.12.09
申请人 NIPPON DENKI KK 发明人 MIYAMOTO TAKASHI
分类号 H01L21/60;H01L23/498 主分类号 H01L21/60
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