发明名称 DIE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the deformation of a gold wire at the time of molding by forming a dummy cavity, volume thereof is larger than one cavity, at a nose of a runner section or between the nose of the runner section and an end section of a cavity group. CONSTITUTION:The dummy cavities 28(48) are shaped at the nose of the runner section 7 of the die 40 in a method such as a transfer molding method in connecting forms. It is preferable that the volume of the dummy cavity 28 is made larger than that of one of the cavities 10(1-5) connected to the runner by double or more, but the shape is not limited to a circle and may be arbitrary, and a plurality of the cavities may be connectd. In the sectional shape of the die 40, a convex section 49 is formed around the dummy cavity 48, and made higher than the surroundings of the cavities 10 only by the thickness of a lead frame. Accordingly, the flow rate of resin sent from a pot section 6 by pressure at the time when the resin flows into the cavity (for example, 5) near the end section of the runner can be delayed, and deformation at the time of the sealing of the gold wire can be prevented.
申请公布号 JPS5795636(A) 申请公布日期 1982.06.14
申请号 JP19800171611 申请日期 1980.12.05
申请人 NIPPON DENKI KK 发明人 MATSUBARA YUUJI
分类号 B29C43/00;B29C45/00;B29C45/02;B29C45/14;B29C45/26;H01L21/56 主分类号 B29C43/00
代理机构 代理人
主权项
地址