| 摘要 |
PURPOSE:To perform the bonding of raised wire loop at a high speed by a method wherein a capillary is shifted from the first bonding point to the second bonding point in such a manner that the highest rising position describes an angular locus. CONSTITUTION:For example, after a wire has been press-connected to the first bonding point a on a pellet 1, the capillary is raised to point b, and then the capillary is shifted to point c which is the reverse direction to the second bonding point g on the outer lead 2. Then, after the cappilary has been raised to point d, it is raised diagonally to the highest rising position e of the height H, and after it has been lowered diagonally to point f directly above point g, it is lowered to the point g and the wire is press-cinnected. Through these procedures, a pellet short-circuit, a tab short-circuit and the like can be prevented by making the wire loop shape higher, and the shifting of the capillary can also be performed at a high speed. |
