| 摘要 |
A method and product produced thereby of bonding insulation board to a substrate. The method comprises applying by spraying a layer of an adhesive (which may be foamed by water or a fluorocarbon) to a substrate, positioning the insulation board on the substrate in the desired position prior to curing the adhesive followed by curing the adhesive. The adhesive consists of a heated mixture of a polyurethane adhesive and an isocyanate curing catalyst which are admixed at substantially equal viscosities in a proportion to permit curing the adhesive at a temperature of less than 140`F. The insulation board is positioned on the adhesive preferably from about one to about ten minutes after spraying the adhesive layer onto the surface of the substrate. |
