发明名称 DIE APPARATUS FOR HOLLOW FORMING
摘要 PURPOSE:To prevent the ununiformity of cooling accompanied with the fluctuation of thickness of a formed body and the roughening of the surface of the formed body by a method wherein laminal cooling elements are provided along the formed surface on the surface layer part of the formed surface of a die adjacent to the thick zone of the formed body. CONSTITUTION:A forming surface 13 of a die corresponding to the mouth of a vessel is composed of die inserts 5a, 5b for cooling the opening in which laminal cooling 4a, 4b provided curvedly along this forming surface are built respectively. Die inserts 8a, 8b for cooling the bottom part to which elements 7a, 7b have been attached previously so that a pair of laminal cooling elements 7a, 7b are arranged along this formed surface are joined with the lower part of the formed surface 6 of the die corresponding to the bottom part of the vessel. The laminal cooling element applies Peltier effect.
申请公布号 JPS5784825(A) 申请公布日期 1982.05.27
申请号 JP19800161088 申请日期 1980.11.15
申请人 DAINIPPON INSATSU KK 发明人 YAMADA KANEO
分类号 B29C33/02;B29C33/04;B29C35/16;B29C49/00;B29C49/42;B29C49/48;B29C65/00 主分类号 B29C33/02
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