| 摘要 |
PURPOSE:To obtain a high-sensitivity, superior-linearity pressure sensor whose decrease in reliability is suppressed while the evil influence of a protective resin film is reduced, by covering a semiconductor pellet for the sensor with the prescribed thin protective resin film. CONSTITUTION:A pellet 2 made of a semiconductor of hollow structure mounted on a package substrate 1 and positioned inside of a sealer cap 5 is protected from the outside air by a thin protective film 14 of silicone resin which has <=100mum thickness. The influence upon the strain rate of a diaphragm is nearly disregarded because of the thickness of the protective resin film. Further, the sufficient operation of the protective film on the outside is maintained. Therefore, the decreases in sensitivity and linearity of the protective resin film 14 are evaded and the reliability of a pressure sensor is improved sufficiently. |
