| 摘要 |
PURPOSE:To enhance the position accuracy of the end of an inner lead of a semiconductor device by eventually forming the inner lead after a lead frame is bonded fixedly to an insulating substrate. CONSTITUTION:A scratch is formed at the endmost of the end of an inner lead 1, the endmost is throttled from reverse direction and is slightly connected. The inner lead is bonded fixedly to an insulating substrate in this state, and then the shaped part 2 (an unnecessary part to be cut to form an inner lead) is pulled and torn, and the inner lead is thus eventually formed. In this manner, the position accuracy of the end of the inner lead can be enhanced. |
