| 摘要 |
PURPOSE:To largely reduce the production cost of a semiconductor element by connecting a metallic lead to a disc covered with metal similar in thermal expansion coefficient to the Si pellet. CONSTITUTION:A hole to which a metallic lead is inserted is formed at the center of a disc 3, and an expanded diameter part 4a is formed at the opening end of the hole. A conductive layer 5 of metal having similar thermal expansion coefficient to the Si pellet is formed at the disc 3. Then, a lead 1 formed at one end with a header 1a is inserted into the hole 4, and the header of the lead 1 and one end of the shaft are connected via a solder 6. According to this structure, the entire disc 3 is not formed of expensive metal such as Mo, and accordingly the production cost can be remarkably reduced. |
