摘要 |
PURPOSE:To enhance the reliability of a plurality of lead nodes in a heat-sensitive recording head having a simplified structure, by connecting leads to a plurality of heater-driving circuit elements at a part where a glass glaze layer is not formed. CONSTITUTION:A glass layer 5 is not formed at nodes 15, 16 in contact with a lead 8a, so that outer lead bonding can be performed without breakdown of the glaze layer during bonding. Individual electrodes 11b, 12b of a heater 1 are multi-layered ones, to inhibit increase of electrode resistance and disconnection of the electrodes at a boundary adjacent to the galze layer. |