| 摘要 |
PURPOSE:To facilitate thinnerization and miniaturization of a package, by connecting an integrated circuit electrode and an external terminal via a through- hole of a printed circuit board. CONSTITUTION:A semiconductor integrated circuit 1 is mounted on a printed circuit board 6. A metal wire 4 and a conductive lead 7 are connected. The conductive lead 7 and an external terminal 9 are connected via a through-hole 8. The integrated circuit 1 is sealed with resin 5. This takes more external terminals. The resin-sealing on one surface enables thinnerization and miniaturization of a package. |
