| 摘要 |
PURPOSE:To enable to perform heat-compression bonding of a bonding wire and a semiconductor element without affecting to solder fixing the semiconductor element and using small electric power by a method wherein a heating means is provided on the outside circumference of a capillary tube. CONSTITUTION:A lead frame 5 and the semiconductor element 3 on a processing base 8 are fixed with solder 4, and when a bonding wire 2 is to be connected to an electrode of the element using the capillary tube 11, a nichrome wire 7 is wound around the outside circumference of the capillary tube 11, the nichrome wire is heated when a gold ball 2a is to be adhered to the electrode on the surface of the semiconductor element 3 by thermo compression bonding drawing down the capillary tube 11, and the gold ball 2a is heated and heat compression bonding is performed. Accordingly heat is not transmitted to the lead frame or solder, and bonding can be performed with smaller electric power as compared with a heater block. |
