SOLDERING METHOD FOR STAINLESS STEEL

摘要

PURPOSE:To perform a soldering on a stainless steel without any deterioration in a material by brushing a brush on which numerous copper or copper alloys are planted by touching it on the surface of a stainless steel and performing a soldering by forming the plating layer of copper or copper alloy mechanically on the surface of the stainless steel. CONSTITUTION:A copper or copper alloy plating layer is formed with the mechanical plating method of brushing the brush planting much copper or copper alloys consisting of either a wire, ribbon or tape by touching on the surface of a stainless steel. Consequently a plating layer is easily formed without any material deterioration due to such heat history on the stainless steel as in a hot dipping method to be able to perform a soldering.