发明名称 Method of Forming a Wire Bond
摘要 <p>A wire (6) made of aluminium or an aluminium alloy is passed through a capillary (5) and a first spark discharge is produced in a protective gas atmosphere between two auxiliary electrodes (12, 13). As a result of this the protective gas is ionised to form a plasma having such a low resistance that a spark discharge takes place between an electrode (11) and the wire (6) at a voltage of between 25V and 200V. Thus a ball is formed at the end of the wire which is then bonded between an electronic microcircuit (17) and a contact area (18) using the capillary. <IMAGE></p>
申请公布号 GB2086297(A) 申请公布日期 1982.05.12
申请号 GB19810032183 申请日期 1981.10.26
申请人 PHILIPS NV 发明人
分类号 H01L21/00;H01L21/60;H01L21/603;H01L21/607;(IPC1-7):23P1/02 主分类号 H01L21/00
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