| 摘要 |
PURPOSE:To make it needless to cut and form lead wires by a method wherein a thermal radiating part is built in the face of an integrated circuit, this thermal radiating part is connected to the integrated circuit with a good thermal conductor, and the distance between a multilayer wiring baseplate and a thermal radiating plate is kept constant. CONSTITUTION:Lead wires 6 of an integrated circuit 5 are positioned on corresponding conductor parts 2 of a multilayer wiring baseplate 1, being connected in thermal pressure. Next, a thermal radiating part 4 is positioned in the face of the integrated circuit 5. After that, the thermal radiating part 4 is connected to the integrated circuit 5 by soldering or another technique, and a radiator 7 is installed if needed. In this mounting process, mechanical tools 8 are mounted on the sides of both the baseplate and the thermal radiating part so that the distance between those is kept constant. |
