| 摘要 |
PURPOSE:To improve electric conductivity and strength of a lead out electrode to enhance its reliability as well as to raise its production yield by laying only barrier metal layer in a contact hole etched away in a protective layer. CONSTITUTION:A wiring layer 11 with a fixed pattern is formed on a substrate 10. An adhesion metal layer 12 made of Cr and others is selectively laid on the wiring layer 11. Then, a protective layer 13 is convered on it, and after that a contact hole 14 connecting with the adhesion metal layer 12 is etched away in the protective layer. Subsequently, a barrier metal layer 15 made of copper and others is formed on the surface of adhesion metal layer 12 and the whole surface of protective layer 13. A resist layer 18 is coated on the surface of barrier metal layer 15, and a contact hole is etched away in this resist layer 18. Next, a gold bump 16 is built on the resist layer 18. Afterwards, the resist layer 18 is etched away, and the barrier metal 15 is patterned. |
