Semiconductor enclosure hermetically sealed by cover in oven - after solder ring is first point-welded to cover

摘要

The arrangement is intended for producing a hermetically sealed enclosure (for a semi-conductor) consisting of a capsule with a cavity and a cover secured to the area around the perimeter of this cavity by means of a solder ring. The solder ring is first locally secured to the cover by applying heat at a number of separate points after which the cover is aligned on the capsule and the assembly is heated, e.g. in an oven, to a temperature sufficient to fuse the ring to the cover and the capsule. Used for producing a hermetically sealed enclosure contg. semi-conductor by soldering cover around perimeter of cavity in capsule containing semiconductor. The arrangement reduces cost of material and simplifies the operation as compared with prior art. The final fushing operation takes place at lower temperature of cover and capsule so that it is quicker and prevents build up of gas in the cavity which can unfavourably affect the semi-conductor. It facilitates automation of the assembly operations.