发明名称 PLATING APPARATUS
摘要 PURPOSE:To necessitate no flexible pipe as a plating liquid supply pipe, in an apparatus for forming a plating casing by an upper jig and a lower jig comprising a nonconductive member, by providing an outlet and an inlet of a plating liquid to the lower jig. CONSTITUTION:A plating casing 13 is constituted from an upper jig 10 and a lower jig 11 comprising a nonconductive material. An inlet 16 and an outlet 21 of a plating liquid are provided to the lower jig 11 and communicated with a passage 18 of the plating liquid. The upper and the lower jigs 10, 11 are stacked and sealed by a sealing material 12 to form a liquid-tight condition between both jigs and, in a plating chamber 19 forming both jigs 10, 11, a cylindrical material 22 to be plated is placed and, between an anode 23 arranged to a central part thereof and a cylinder 22 as a cathode, current is passed to subject an inner surface of the cylinder 22 to plating treatment. In moving the upper jig 10 from an upper surface of the lower jig 11 when the material 22 to be plated is introduced in and taken out from the plating chamber, because the inlet 16 of the plating liquid is provided to the lower jig 11, a flexible arranged pipe is not necessitated and an inexpensive fixed pipe can be attached to the inlet 16.
申请公布号 JPS5770290(A) 申请公布日期 1982.04.30
申请号 JP19800144889 申请日期 1980.10.16
申请人 AISHIN SEIKI KK 发明人 ONDA TSUTOMU;KANOU KEIICHI;ITAKURA SHINJI
分类号 C25D5/08;C25D7/04;C25D17/00 主分类号 C25D5/08
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