| 摘要 |
PURPOSE:To shorten wire length extremely, and to reduce an effect having electrical characteristics by forming a protruding section to a mount section for an IC element while electrically connecting the protruding section and the IC element by a wire. CONSTITUTION:Protruding sections 131 are shaped as close as possible to wire bonding pads for a GaAsIC element 2 on a mount section 13 for the IC element 2. Consequently, wire length can be shortened extremely, and outer leads 11, 12 as ground electrodes are unified with the mount section 13 for the GaAsIC element 2. Accordingly, the rise of ground potential by built-up construction and the deterioration of electrical characteristics by parasitic inductance can be reduced. The protruding sections 131 are shaped, thus preventing the flow of solder or adhesives 3 and then easily adjusting wire length. |
