发明名称 MOLDING METHOD AND DEVICE FOR RESIN OF SEMICONDUCTOR ELEMENT IN LEAD FRAME
摘要 PURPOSE:To simplify the loading mechanism of a lead frame, to continuously automate the steps and to accelerate the operation by elevationally moving a baking unit and a molding press, and handling the lead frame with a horizontally moving loading unit. CONSTITUTION:An elevationally movable baking unit 11 and a molding press are linearly arranged, and a horizontally moving loading unit 13 and an unloading unit 15 are provided above them. Heated lead frame 12 is contacted and received by the loading unit 13 disposed above the unit 11 by raising the unit 11, and is conveyed to a pressing position. Subsequently, the lower die 14 of the press is raised, is contacted with the conveyed lead frame 12, and the lead frame 12 is set in a mold. When it is molded completely, the unloading unit 15 is similary operated to be conveyed to the next step. In this manner, the loading mechanism is simplified to the horizontal movement, thereby reducing the size and accelerating the operation, and enabling the continuous automation coupled with the preceding and following steps.
申请公布号 JPS5768039(A) 申请公布日期 1982.04.26
申请号 JP19800143618 申请日期 1980.10.16
申请人 TOKYO SHIBAURA DENKI KK 发明人 NUMAJIRI KAZUO;KUSAKARI TERUO
分类号 H01L21/56;(IPC1-7):01L21/56 主分类号 H01L21/56
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