| 摘要 |
PURPOSE:To lessen the deformation due to resin seal, by a method wherein the direction of the resistance element formed in a rectangular semiconductor element is set so as to have an inclination of approximately 45 degrees with respect to one side of a square package made of resin to be used for molding. CONSTITUTION:A rectangular semiconductor element 11 is formed into a given semiconductor circuit by integrating resistance elements 12, 13 and the like, the element 11 being sealed with a square package 15 made of an insulative resin by means of molding. Setting the mountig angle theta of the element 11 with respect to one side of the package 15 so as to be approximately 45 degrees permits the change in resistance of the elements 12, 13 due to deformation to be made smaller. |
