| 摘要 |
PURPOSE:To ensure the connection between the patterns by arranging like letter V the throughholes prepared in the substrate to connect the lead pattern on the surface of the substrate and the input electrode pattern by the lead pattern on the back of the substrate. CONSTITUTION:The thermal printing head of dot matrix type is formed, of which the plural stripes of letter U type lead pattern 25 (mark 24 is the resister film for thermal printing) prepared on the surface side of the substrate 21 and the plural stripes of the input electrode pattern 26 meeting at right angle with the pattern 25 are connected by the plural stripes of the lead pattern (indicated by the dotted line) prepared on the back side of the substrate 21 via the through holes 22,23 prepared in the substrate 21. On said head by arranging the throughholes 22a-22f and 23a- 23f of the substrate 21 like letter V respectively, it is possible to make the diameter of the throughhole large, so the sure connection between patterns can be formed readily. |
