| 摘要 |
A solder resist, i.e., a material that is not wet by and hence not adhered to by solder is applied to a portion of a sheet metal blank. The sheet metal blank is stamped and formed to produce a substantially cylindrical female terminal for receipt of a plug-in male terminal as of a solid state device. The terminal is flow soldered in place in a printed circuit board, and the solder resist prevents solder from adhering in areas where it would adversely affect operability of the female terminal. |
