发明名称 CURABLE COMPOSITION
摘要 PURPOSE:A curable composition with excellent adhesion and water resistance, and good peeling strength against a metal, comprising a composition prepd. by dispersing a specified polymer in an epoxy compd. and a curing agent for the epoxy compd. CONSTITUTION:An epoxy compd. (a) of epoxy eq. 150-800 having on the average at least one 1,2-epoxy group in one molecule is mixed with 10-100wt%, based on the component (a), monomer mixt. (b) consisting of an adduct of a hydroxyacrylate with a isocyanate prepolymer and an ethylenically unsaturated monomer sush as butadiene and the resulting mixt. is subjected to reaction, in an inert gas atmosphere at 100-130 deg.C for 2-5hr to obtain a composition (A) consisting of the epoxy compd. in which a polymer is dispersed. Then a curing agent for the epoxy compd. such as ethylenediamine is added to the component A.
申请公布号 JPS5757745(A) 申请公布日期 1982.04.07
申请号 JP19800132599 申请日期 1980.09.24
申请人 ASAHI DENKA KOGYO KK;EE SHII AARU KK 发明人 SUZUKI HIROSHI;ASAKAWA YUTAKA
分类号 C08L51/00;C08G59/00;C08G59/18;C08G59/40;C08J3/16;C08L51/08;C08L55/00;C08L63/00;C09J163/00 主分类号 C08L51/00
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