| 摘要 |
PURPOSE:To enhance stability and to reduce generation of inferiority in wire bonding of semiconductor device by a method wherein a sensor to neasure dynamic load at every bonding is fixed to a bonding device and a closed loop system to regulate and control dynamic load according to the measured results in sequential order is provided. CONSTITUTION:For example, in a device of plate spring method to operated an arm 2 in the vertical direction, the sensor 4 for measurement of dynamic strain is fixed to a plate spring 3. And in a device of cam method, the sensor 4' is fixed to the rotation supporting part 5 of an arm 2'. Bonding is performed measuring dynamic load in sequential order by the sensor 4, 4' about one IC. When bonding of next IC is to be performed, regulation is performed to hold dynamic load at a constant confoming to the previous data, and dynamic load after regulation is measured as the next data. For regulation and control by this closed loop, microcomputor, etc., for example, is used. Accordingly dynamic load can be held at a constant, and damage, etc., to be caused by high speed bonding can be prevented. |
