| 摘要 |
After resistance layer(10), conductor layers(11) and protection films(12) are attached to the upper of the substance for thin film, the thin film circuit is made and conductor layers, for example Al layers(9), are interposed between substance for thin film(8) and a part of resistance layers. In soldering, the interposed Al layers make the resistance layers(10) very thin and the defect(15) in the conductor layers(11) is made short.
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