| 摘要 |
1,234,821. Metal laminates. BUNKERRAMO CORP. 27 Aug., 1968 [8 Sept., 1967], No. 40837/68. Heading B5N. [Also in Division B3] An assembly comprises at least two stacked sheets bonded together over a predetermined surface area portion, a plurality of grooves being formed in each opposed surface to define a plurality of ribs and a bonding agent being disposed in the grooves to bond the sheets together. The opposed surfaces are arranged so that the grooves are perpendicular to one another and portions of the ribs engage, anomolies on the tops of the ribs having been removed by ductile movement of rib material. In a circuit structure 10, Fig. 1, comprising aluminium, copper, silver, gold, magnesium or steel sheets 11, 12, 34 of thickness from 1 mil. or less to greater than 0À05 inch, bonded together and having a circuit pattern provided by leads 14 in etched vertical channels 25 filled with dielectric material 13, horizontal leads 14<SP>1</SP> and a lead 14<SP>1</SP> in a horizontal channel 26 filled with dielectric material 27, the sheets are bonded together by means of solder, epoxy loaded with conductive material or a non-conductive resin. When non-conductive bonding material is used conductive mating surfaces e.g. gold are under pressure contact. Each facing surface of sheets 11, 12, 34 and of adjacent leads is chemically etched to provide grooves 17, Fig. 5, the dielectric material 13, 27 not being affected. A plating layer 22 may be provided on one of the facing surfaces, the grooves are coated with resin-based flux and a molten lead-tin alloy solder 18 (shown in exploded view in Fig. 5) is caused to fill the grooves. Excess solder is removed by a squeegee and excess flux by alcohol. The sheets are then arranged with the grooves on one sheet at right angles to those on the adjacent sheet and under the application of heat and pressure bonding between the sheets and grooved leads is effected. |
