| 摘要 |
PURPOSE:To prevent the occurrence of a malfunction caused by the intermixing of Si chips by bonding a semiconductor wafer to the first adhesive sheet, isolating elements from semiconductor wafer, sorting the appearance of the element, then transferring the wafer to the second adhesive sheet, and sorting it in term of the second appearance of the element. CONSTITUTION:The semiconductor wafer is bonded to the first adhesive sheet 10, is isolated to elements from each semiconductor wafer 7, the appearance of the element is sorted, the second adhesive sheet 20 having stronger adhesive strength than the first sheet is bonded to the other surface, the first sheet 10 is then exfoliated from each semiconductor element 7, Si chips 19 adhered to the first sheet 10 are removed, and the second appearance of the element is sorted. In this manner, the appearance checking work can be simply and accurately performed, and the occurrence of a malfunction caused by the intermixing of the Si chips can be eliminated. |
