| 摘要 |
PURPOSE:To heat the wafer with radiant heat, and to improve the uniformity and reproducibility of a temperature by mounting a heat radiation section, heat radiation efficiency thereof is increased, onto a heat generating section through a heat-transfer section and supporting the wafer while forming a clearance between the wafer and the surface of the heat radiation section by a spacer. CONSTITUTION:The heat-transfer section HT is shaped on the heat generating section HS into which heater blocks HB are buried, and the wafer mounting section HP, which is coated with carbon, etc. and the heat radiation of the surface section HPS thereof is improved, is formed on the heat-transfer section HT. The cylindrical spacers S consisting of a material having low thermal conductivity such as a nichrome wire are fitted onto the HPS in order to form the clearance between the wafer and the HPS, and arranged so as to support the wafer W by several minute contact areas. Accordingly, the wafer can be heated without extremely damaging thermal efficiency, and the generation of the unevenness of the temperature due to the deformation and repeated use of the wafer can be prevented. |
