| 摘要 |
PURPOSE:A curable resin composition comprising a polyimide modified by amine and polybutadiene or the like, being soluble in a low-boiling general-purpose solvent, being easy to prepare prepreg, having excellent heat resistance and electric characteristics and having adhesion improved. CONSTITUTION:The curable resin composition comprising the reaction product and/or mixture of a polyimide represented by formula I [where R1 is 1-8C bivalent hydrocarbon group; X is H, halogen, 1-10C alkyl, -OH, -COOH, -CN, R2O- or a group of formula II (where R2 is 1-10C alkyl, phenyl or phenyl substituted with 1-5C alkyl or halogen); D is 2-30C bivalent organic group having a C-C double bond and m>0] with an amine compound represented by formula III (where Q is 1-150C n-valent organic group which may contain H, O, S, halogen, N, P or Si and n>=1) and polybutadiene and its derivative, the composition is soluble in a low- boiling general-purpose solvent and improves workability in preparing particularly copper-clad laminates. |
