| 摘要 |
PURPOSE:To remove the oxide film for the solder material, by shifting perforated material in the soldering material in molten condition. CONSTITUTION:The L type bending part of the end of the lead chip 22 is fixed at one end of the heat sink 1 and the perforated material 3 and the soldering material 4 are placed on the upper surface 1a. Oxide film 5 is caused on the solder surface with heating and melting. With this condition, by moving the member 3 upward, the oxide film 5 is picked up with the perforated material. When the element 6 is placed on the solder member and soldering is made, the fixing strength is remarkably improved and the thermal conductivity can be increased. |
