| 发明名称 |
HEAT CURABLE MOLDING COMPOSITION |
| 摘要 |
<p>What is disclosed is an improved heat curable. molding composition which has increased flowability in the mold. The improvement is gained by the use of a fine, spherical inorganic filler along with the normal molding compound fillers.</p> |
| 申请公布号 |
CA1118927(A) |
申请公布日期 |
1982.02.23 |
| 申请号 |
CA19780294424 |
申请日期 |
1978.01.05 |
| 申请人 |
TORAY SILICONE COMPANY, LTD. |
发明人 |
HANADA, TSUNEO;KOSHII, TARO;SHINMI, HIDEO |
| 分类号 |
C08L83/00;C08G59/00;C08K7/16;C08K7/18;C08K7/20;C08L63/00;C08L67/00;C08L83/04;(IPC1-7):C08K7/18;C08K3/36 |
主分类号 |
C08L83/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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