| 摘要 |
PURPOSE:To eliminate the improper bonding of a glass-sealed semiconductor device by bending the end of a glass-sealed lead to be connected to a semiconductor pellet toward the base side. CONSTITUTION:The end of a lead frame 3 to be bonded is bent, and is contacted with the pellet mounting part of the ceramic base. When the base 1 and the lead frame 3 are bonded solderlessly via glasses 2, 2', the height of the leads become equal at the length h of the bent part. Accordingly, the improper bonding does not occur between the pellet 4 and the fine wire 5 of the lead frame 3, thereby improving the reliability. |
