| 摘要 |
PURPOSE:To improve the moisture resistance of an electronic part and to enable the reuse of the part by sealing the part with resin composition containing polyphenylene sulfide resin as main ingredient. CONSTITUTION:An electronic part is sealed with resin composition containing 100pts.wt. of polyphenylene sulfide resin, the formula (R)a(H)bSiO2-a/2-b/2, where R represents one-valency hydrocarbon group, 0<a<=3, 0<=b<=1, and 0.5<=a+b<4, of organic silicon compound of 0.1-70pts.wt. and inorganic filler of 50-300pts.wt. Thus, since it has large adhesiveness to the frame or lead wire of the part, the moisture resistance of the part can be improved, the molding cycle can be shortened, and the reuse of the scrap can be enabled. |
