| 摘要 |
PURPOSE:To prevent grind particles from being dropped during the cutting process by applying the eutectoid plating layer of grind particles such as diamond and a metal such as nickel to a substratum then by applying a protective plating layer further to the remaining grind particles protruded through the plating layer. CONSTITUTION:The eutectoid plating of grind particles 1 such as diamond and a metal 2 such as nickel is applied to a substratum 3 such as stainless steel, then a protective plating layer 4 of a solution containing nickel sulfamic acid, nickel chloride, and boric acid is formed with such a thickness that the grind particles protruded through the eutectoid plating layer are not buried. |
