发明名称 HEAT-STORING MATERIAL COMPOSITION
摘要 PURPOSE:An organic heat-storing material composition that contains a powder or flakes of a high thermally conductive substance and an antisettling additive therefor, thus having improved thermal conductivity without any adverse effect on the long- term stability. CONSTITUTION:The objective heat-storing material composition of obtained by using (A) a high thermally conductive powder or flakes of less than 100 micron thickness, with a thermal conductivity of higher than 0.01cal/cm.sec. deg.C by 1- 20vol% and (B) an antisettling agent for component A such as a fine powder of inorganic compound such as silica and/or asbestos. As an example of component A, is used metal or alloy of iron, copper, nickel or magnesium, metal oxide such as alumina or beryllia, carbon black or graphite. A suitable example of component B is asbestos fiber of less than 0.18g/cc aparent density and of 2-15mm. length.
申请公布号 JPS5710675(A) 申请公布日期 1982.01.20
申请号 JP19800085533 申请日期 1980.06.23
申请人 DAIKIN IND LTD 发明人 SHIBUYA YOSHIYUKI;TOMIHASHI NOBUYUKI;OKAMURA KAZUO;DAIMON SHIGEO
分类号 C09K5/06;C09K5/00 主分类号 C09K5/06
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