发明名称 MANUFACTURING APPARATUS OF SEMICONDUCTOR
摘要 PURPOSE:To prevent contamination from a heat source and a container, e.g., in a high pressure oxidizing process, by applying heat resistant coating on the inner wall of the pressure resistant container which encloses substrates, and heat-processing the substrate by a lamp hermetically sealed in a container. CONSTITUTION:A thermally oxidized film is formed on, e.g., Si substrates 10 at a high temperature and high pressure in the apparatus 1. On the wall of the pressure resistant container comprising a metallic chamber 2 and a lid 3, an SiO2 film obtained by oxidizing an NoSi2 sputtered film is formed, and the coating 20 is provided. The wafers 10 which are held by a boat 9 are placed on a table 8 in said container, and H2 and O2 are introduced from nozzles 6 and 7. Then wafers 10 are heated and oxidized by the lamp 4 hermetically sealed in the quartz tube 5. On this constitution, the introduction of contaminants at the high-temperature and high- pressure process can be prevented. This apparatus is suitable for processes such as nitridation, diffusion, and the like, in addn. to the oxidation.
申请公布号 JPS5710241(A) 申请公布日期 1982.01.19
申请号 JP19800084813 申请日期 1980.06.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 ITOU KAZUO;HARADA HIROJI;MIZUGUCHI KAZUO;DENDA MASAHIKO;KINOSHITA SHIGEJI
分类号 H01L21/31;C23C8/06;F24F13/02;H01L21/316;(IPC1-7):01L21/316 主分类号 H01L21/31
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